Our Capabilities


Manufacturing Capabilities

Minimum Track Width

0.15mm

Minimum Track Spacing

0.15mm

Minimum Track to Edge Clearance

0.15mm

Minimum Hole Position Tolerance

+/-0.15mm

Minimum PTH Hole Dia

0.30mm

Minimum Pad Dia

0.40mm

Minimum Annular Ring

0.05mm

Maximum Aspect Ratio PTH

5

Maximum Screen Printed Solder Window to Pad Edge

0.05mm

Hole Diameter Tolerence PTH Upto:
     0.80 mm
     0.81 TO 1.60 mm
     1.61 TO 5.00 mm
non PTH:
     1.60mm
     1.61 mm to 5.00 mm


+/-0.05mm
+/-0.05mm
+/-0.10mm

+/-0.05mm
+/-0.10mm


Surface Finishes
- Solder Mask on Bare Copper (SMOBC) with hot air levelling
- Solder Mask on Bare Copper (SMOBC) with solderable lacquer
- Solder Mask on black oxide coating with hot air levelling
- Solder Mask on tin/lead fused tracks


All these finishes can be given in:
- Liquid Photo imageable Solder Mask
- Liquid Screen Printed Solder Mask
- Dry Film Solder Mask
- Tin/Lead fused finish without Solder Mask
- Gold Plating over Nickel on Tabs and Pads
- Electrolytic Nickel plating on Tabs and Pads
- Carbon printing on Tabs or Fingers
- Peelable Solder Mask


Specifications and Standards being followed:
1. IPC A600E, IPC SM 840C, IPC L 115B, IPC QE 605, IPC RB 276, IPC TM650
2. MIL 55110P, MIL STD 275, MIL P13949G, MIL STD 105P
3. BS 9760, 9762, 9763
4. IEC 326 & 249
5. IECQ C001001 & 001002
6. B.S. CECC 23000, B.S. 232000, B.S. SECC 23200 800
7. DGN 88D6
8. PREFAG IC & PREFAG 2D


Our Capacities:

Double Sided PTH
Single Sided
MLB 4/6/8 Layers

3500 sq. mtrs. per month
500 sq. mtrs. per month
1000 sq. mtrs. per month